Intel’s 18A Process vs. TSMC’s N2: A Comparison of Semiconductor Manufacturing Technologies
Intel’s 18A process could offer superior performance compared to TSMC’s N2 process, according to recent revelations at the International Electronic Devices Meeting (IEDM). While TSMC may have the edge in transistor density, Intel’s focus on performance and power efficiency with features like PowerVia could give them an advantage.
TechInsights analysis shows that TSMC’s N2 process boasts a higher transistor density than Intel’s 18A, but Intel’s process may offer better performance gains based on past node transitions. However, direct comparisons between the two technologies remain challenging.
Intel’s 18A is set to enter mass production in mid-2025, aligning with the release of their Core Ultra 3-series ‘Panther Lake’ processors. In contrast, TSMC’s N2 process is not expected to enter high-volume manufacturing until late 2025, with commercial products arriving in mid-2026.
The competition between Intel and TSMC in the semiconductor manufacturing space is heating up, with both companies vying for technological supremacy. Stay tuned for more updates on this exciting development in the world of chip manufacturing.
