TSMC VP believes technology will continue to advance with or without Moore’s Law, thanks to 3D chip packaging

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The Evolution of Semiconductor Technology: A Conversation with TSMC’s Dr. Kevin Zhang

In a recent interview with Dr. Kevin Zhang, head of TSMC’s process technologies, he expressed his indifference towards Moore’s Law, stating that as long as technology scaling continues, he is not concerned about its status. TSMC, known for introducing a new process technology every year, focuses on providing performance, power, and area improvements for its clients. With Apple as its alpha customer for the past decade, TSMC’s advancements in process technologies are closely tied to the evolution of Apple’s processors.

Beyond Apple’s processors, TSMC’s capabilities are showcased in products like AMD’s Instinct MI300X and Instinct MI300A processors, which utilize TSMC’s 2.5D and 3D integration for AI and HPC capabilities. The foundry and its customers are now focused on 3D scaling, moving away from the traditional two-dimensional scaling associated with Moore’s Law.

Zhang emphasized that TSMC’s incremental process node improvements are significant, with transitions from 5nm to 3nm-class process nodes resulting in PPA improvements exceeding 30% per generation. By continuously enhancing technologies between major nodes, TSMC enables its customers to benefit from each new technology generation. The foundry’s commitment to innovation and progress in the semiconductor market remains unwavering, regardless of the status of Moore’s Law.

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